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Epotec® Epoxy Adhesives are formulated for the broadest possible substrate versatility, coupled with performance dependability. Each product meets specialized needs such as thixotropy, high temperature, and non-sag among other things.
| System | Mixing Ratio1 | Mix Viscosity2 | Pot Life3 | Tg4 | Features |
|---|
YD1100 /
TH7152 | 100 : 27 | 2,500 - 3,500 | 15 - 20 | 65 - 75 | Low density epoxy foam adhesive for light weight components. | YD1101 /
TH7298 | 100 : 40 | 5,000 - 10,000 | 15 - 25 | 85 - 95 | Expandable epoxy with excellent adhesion strength to most of the substrates. | YD1535 /
TH7254C | 100 : 45 | - | 10 - 15 | 80 - 90 | Fast reactive, thixotropic, paste adhesive for excellent bending. | YD1535 /
TH7255C | 100 : 45 | - | 30 - 40 | 80 - 90 | Medium reactive, thixotropic, paste adhesive for high strength. | YD1535 /
TH7256C | 100 : 45 | - | 70 - 100 | 80 - 90 | Slow reactive, thixotropic, paste adhesive for high strength. | YD1535 /
TH7257C | 100 : 45 | - | 220 - 300 | 80 - 90 | Extra slow, thixotropic, paste adhesive for high strength. | YD7253 /
TH7271 | 100 : 50 | - | 20-30 | 100 - 120 | Fast reactive, thixotropic, paste adhesive for high chemical resistant joints. |
1 Part by Weight
2 @ 25°C (cPs)
3 Minutes, @ 25°C 100 grams Mix
4 Glass Transition Temperature (°C), Differential Scanning Calorimeter (DSC)
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