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Epotec® Resin and Curing Agent System for Filament Winding and Pultrusion are designed to meet process requirements such as low viscosity, long pot life, accelerated curing at elevated temperature. Epotec® Systems can suitably be applied for manufacture of pressure pipes, water and effluent, CNG storage cylinders, underground cable covers, storage and transportation tanks, tubes and pipes for defense, aeronautics, aerospace, and reverse osmosis.
| System | Mixing Ratio1 | Mix Viscosity2 | Pot Life3 | Tg4 | Features |
|---|
YDL535 /
TH7354 | 100 : 35 | 500 - 1,000 | 8 - 10 | 145 - 155 | Low viscosity, long pot life system suitable to cure at ambient temperature, post curing above 120°C is required. | YDL549 /
TH7660 | 100 : 85 | 400 - 800 | 8 | 140 - 150 | Elevated temperature curing system for fast production with good elongation. | YDL582 /
TH7255 | 100 : 35 | 500 - 750 | 25 - 35 mins. | 80 - 90 | Low viscosity, fast, ambient cure system for small components. | YDL582 /
TH7256 | 100 : 35 | 500 - 650 | 80 - 100 mins. | 80 - 90 | Ambient temperature cure, low viscosity system for small components with medium reactivity. | YDL582 /
TH7257 | 100 : 35 | 200 - 500 | 4.5 - 5.5 | 80 - 90 | Ambient temperature cure, slow reactive system with very low viscosity for farely large components. | YDL660 /
TH7455 | 100 : 25 | 1,500 - 3,500 | > 16 | 170 - 200 | Very slow reactive, ambient cure system for high glass transition temperature (Tg). Post curing required above 160°C. | YDL670 /
TH7353 | 100 : 22 | 1,000 - 2,000 | 1 - 3 | 130 - 180 | High temperature resistance, medium viscosity system for ambient curing, post curing above 120°C is required to achieve full strength. | YDL670 /
TH7354 | 100 : 35 | 500 - 1,000 | 8 - 10 | 130 - 180 | Long pot life, high temperature resistant system. Post curing above 140°C is required. | YDL680 /
TH7652 /
TA7851 | 100 : 80 : 1 - 2 | 500 - 1,000 | > 10 | 130 - 160 | Low viscosity, long pot life, elevated temperature cure system for large components. | YDL680 /
TH7661 /
TA7851 | 100 : 85 : 1 - 2 | 1,000 - 2,500 | > 10 | 150 - 180 | Low viscosity, long pot life, elevated temperature cure system for high thermal resistance. | YDL690 /
TH7455 | 100 : 25 | 3,000 - 6,000 @ 50°C | > 16 | 220 - 240 | Very slow reactive, ambient cure system for excellent thermal resistance. Post curing above 200°C is required to achieve full strength. |
1 Part by Weight
2 @ 25°C (cPs)
3 Hours, @ 25°C 100 grams Mix
4 Glass Transition Temperature (°C), Differential Scanning Calorimeter (DSC)
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