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Epotec® Epoxy Resins for Electrical Applications is best-known for castings into mold, cavities, cores and patterns. They are also extensively used for encapsulation and protection of electrical and electronic components. Room-temperature curing resins are preferred for low voltage, small components, while heat-cure resins offer extremely high physical, thermal and chemical properties and used for medium and high voltage applications in electrical and electronic industries.

SystemMixing Ratio1Mix Viscosity2Pot Life3Tg4Features
YDC6001 /
TH7656
100 : 301,900/1206 - 8/120110 - 120Semisolid resin and solid hardener with low viscosity at elevated temperature. Suitable for high voltage and medium voltage applications such as switch gear, bushings instrument and distribution transformer.
YDC6002 /
TH7657
100 : 304,000/1201 - 2/120110 - 120Semisolid resin and solid hardener with medium viscosity at elevated temperature. Suitable for high voltage and medium voltage applications such as switch gear, bushings instrument and distribution transformer.
YDC6003 /
TH7658
100 : 80150,000/251.5 - 2.5/80110 - 125Liquid modified resin with liquid hardeners capable to give high Tg. Suitable for high voltage and medium voltage applications such as switch gear, bushings instrument and distribution transformer.
YDC6003 /
TH7662
100 : 80200,000/251.5 - 2.5/80100 - 110Liquid modified resin with liquid hardener. Suitable for high voltage and medium voltage applications such as switch gear, bushings instrument and distribution transformer.
YDC6004 /
TH7657 /
TA7851 /
TP01
100 : 100 : 1 : 101,500/801 - 2/8090 - 100Modified liquid resin suitable for high thermal shock resistance. Used for high voltage and medium voltage applications such as switchgear, bushings instrument and distribution transformer.
YDC6005 /
TH7657 /
TA7851
100 : 80 : 110,000/602 - 3/25110 - 120Modified liquid resin suitable for conventional casting with good thermal shock resistance.
YDC6006 /
TH7269
100 : 9 - 1015,500 - 16,000/25< 1/2555 - 65Modified liquid system with amine hardener to cure at ambient temperature. Suitable for small low voltage components.
YDC6011 /
TH7281
100 : 25400 - 500/252 - 3/25 (100 grams mix)35 - 45Very low viscosity, ambient cure system for low voltage, small components.
YDC6015 /
TH7652P /
TP01
100 : 80 : 0 - 810,000/601 - 2/25100 - 110Liquid modified system with flexibilizer. Suitable for medium and high voltage applications.
YDC6016 /
TH7658
100 : 8040,000/40-115 - 125Liquid modified system with excellent crack resistance and high Tg for encapsulation of large, high and medium voltage components.
YDC6016 /
TH7662
100 : 8040,000/40< 1/2595 - 105Liquid modified system with excellent crack resistance property for large, high and medium voltage components.
YDC6017 /
TH7158
100 : 50400/2560/4040 - 45Modified liquid resin with ambient cure hardener. This system is suitable for small, low voltage components.
YDC6018 /
TH8251
100 : 186,000/60< 1/25 (100 grams mix)60 - 70Expandable two-component system, suitable to cure at ambient temperature. Lightweight components can be achieve with excellent insulation for low voltage applications.
YDH184 /
TH7351 /
TA7851
100 : 90 : 0.5 - 31,000/801 - 1.5/80100 - 110Cycloaliphatic resin and hardener for UV resistant, out door application.
YDH184M1 /
TH7356P
100 : 80300 - 6006 - 8/4075 - 80Liquid, modified cycloaliphatic system for low shrinkage and crack resistance.

1 Part by Weight
2 cPs / °C
3 Hours / °C
4 Glass Transition Temperature (°C), Differential Scanning Calorimeter (DSC)